Technical advice on heat pipes and vapor chambers.
We provide support from product design for HP and VC to process design and manufacturing equipment development.
Heat pipes (HP) and vapor chambers (VC) are used as heat dissipation methods, particularly for electronic components and devices such as CPUs, GPUs, and power devices. In these fields, there is a tendency for increased integration density, and the heat generation density has significantly exceeded 100 W/cm². Therefore, there is an increasing need for high-performance heat dissipation devices. Furthermore, it is believed that applications will advance not only in electronic and electrical devices but also in heat dissipation measures for lithium-ion batteries and methods for temperature uniformity in housing and agriculture.
- Company：プロセスD&Tラボ 千葉
- Price：100,000 yen-500,000 yen
